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Data center & communications infrastructure

We are at the forefront of enabling fast, efficient data transmission and high-efficiency power delivery within and across data centers and communications infrastructure. Our advanced solutions are shaping the future of modern connectivity while meeting the growing demands for bandwidth and power.

Rising data demands are driving the need for faster, more power‑efficient technologies

As AI infrastructures scale within the rack, across the data center and between systems, the challenge is no longer compute alone. Chip designers must now solve for faster data movement, more efficient power delivery, higher signal integrity and reliable manufacturing at scale.

  • The limits of copper interconnects

    800G and beyond networks, CXL-enabled memory architectures and silicon photonics are redefining how data moves through hyperscale systems

  • Increasing bandwidth & power pressure

    GPUs, XPUs and custom ASICs require higher-current power delivery, lower-loss interconnects and new packaging approaches

  • Increasing RF front-end complexity

    Evolving phased‑array systems depend on ultra‑linear power amplifiers and low‑noise amplifiers to deliver precise, high‑efficiency beam steering and superior signal fidelity

Data center & communications infrastructure applications

Data center power delivery

We enable efficient power delivery for next-generation data centers with high-current voltage regulation and high-density power stages built on power GaN, BCD and CMOS technologies. These solutions help customers deliver power with greater efficiency, density and reliability for AI-scale compute.

Data center networking

We provide advanced silicon for high‑speed wired networks including RF switches, beamformers and precision analog signal paths. Our SiGe, SOI and FDX™ FD-SOI technologies improve signal integrity and reduce loss across high-speed data center and network interconnects.

Data center compute

We are manufacturing the next generation of high-performance computing for data centers, using advanced 2.5D and 3D packaging that binds logic, I/O, HBM and memory into high-density, high-bandwidth systems. For real-world quantum computing, it means the complete quantum hardware solution: quantum processor units (QPUs), cryogenic CMOS control and readout and superconducting interconnects. Together, they bring quantum to data center scale across the leading qubit modalities.

SATCOM

We deliver RF and mixed-signal technologies for cellular, wireless and satellite communications. Our RF GaN, SiGe and RF-SOI platforms support efficient power amplification, low-noise reception and beamforming for high-performance uplink, downlink and ground-terminal systems.

Precision power for AI-scale compute

As AI model sizes continue to grow, GPUs and AI ASICs require dramatically higher currents and tighter voltage regulation. This trend pushes power conversion closer to the point of load and demands devices that combine efficiency, thermal stability and high reliability. We deliver advanced power GaN, BCD and CMOS technologies and integrated passive platforms optimized for fast switching, high current density and the power integrity AI data centers require.

High-speed optical connectivity for accelerated AI clusters

As bandwidth demands exceed the practical limits of copper interconnects, the industry is rapidly shifting from electrical to optical connectivity. Our silicon photonics and SiGe platforms deliver the high-performance optical connectivity needed for next-generation data center system interconnect architectures, supporting emerging standards including OCI, XPO and OpenCXP. These technologies help customers move data efficiently within racks, across data centers and between data center campuses.

Co-packaged optics for AI-scale systems

AI-scale systems need optical connectivity that can move closer to the compute engine while reducing power, latency and system complexity. Our SCALE™ optical module solution, or silicon photonics Co-packaged Advanced Light Engine solution, is designed to support this transition, integrating advanced silicon photonics with high-speed electrical ICs and scalable packaging architectures. Built for modern AI systems, our SCALE CPO solution supports both CWDM and DWDM transmission, delivering efficient, high-bandwidth connectivity across next-generation optical interconnects.

Advanced packaging for high-density data center compute

We support a range of advanced packaging use cases including 2.5D integration, which connects logic, I/O and HBM through silicon interposers and bridges and 3D integration, which stacks memory or I/O directly on logic for tighter coupling and higher compute density. These approaches allow customers to reuse IP across product generations, combine dies from multiple foundries and keep non‑scaling functions like I/O and SRAM on mature, cost‑effective nodes.

Low Earth Orbit (LEO) satellite communications

We support the growth of LEO broadband satellite communications with a mix of process technologies tailored for every part of the signal chain. Our RF and CMOS platforms enable complete end-to-end satellite communication systems, delivering superior sensitivity and power efficiency.

GF business webinar series: GF at the forefront of the photonics & packaging revolution

This webinar showcases how our differentiated platforms and high-performance interconnect technologies are addressing the need for increasing levels of speed, efficiency and scalability for next-generation data and connectivity applications.

Watch webinar

Our trusted partners in data center & communications infrastructure

We collaborate with a global ecosystem of trusted partners to deliver the solutions data centers and communication infrastructure systems demand.

  • Synopsys
  • Cadence
  • Siemens
  • Ansys
  • Keysight
  • Photeon
  • Silicon Creations
  • Innosilicon
  • Star IC
  • Extoll

Latest news & insights

Data center & communications infrastructure

Frequently asked questions

AI and other data‑intensive applications are pushing data centers to handle far more bandwidth while improving power efficiency. These workloads increase pressure on compute fabrics that must move data faster and on power systems that must deliver energy more efficiently. We address these pressures with silicon photonics, SiGe and advanced power technologies that improve performance and reduce energy use across the entire data path.

Silicon Photonics and SiGe enable optical interconnects that deliver much higher data rates, lower latency and significantly better energy efficiency than copper. These platforms support the high‑bandwidth links required for AI clusters and large‑scale cloud deployments. With integrated photonics, RF and CMOS on a single platform, we enable faster and more efficient data movement across modern data center architectures.

We offer the industry’s first 300mm monolithic silicon photonics platform that combines photonics, RF and high‑performance CMOS logic on one die. This level of integration delivers exceptional bandwidth density and energy efficiency for advanced optical networks. It enables the optical engines and interconnects that power AI‑scale data centers and high‑performance communications systems.

We provide a broad set of power solutions that improve efficiency at every conversion stage, from high‑voltage input to sub‑1V power for GPUs and xPUs. Technologies like 55BCD and power GaN enable more efficient delivery of power where it is needed most. These advances help operators lower total energy use while supporting increasingly power‑hungry AI accelerators.

We combine high‑volume manufacturing with a differentiated portfolio spanning silicon photonics, SiGe, RF, CMOS and advanced power technologies. This allows customers to depend on us for fast, efficient and reliable data movement and power delivery across their systems. With a global manufacturing footprint, we support the scaling needs of AI, cloud and next‑generation communications infrastructure.